Live performance,
quarterly holdings.

US-listed equity factor capturing the companies that make orbital data centers viable — radiation-tolerant chips, fault-tolerant power systems, space-grade cooling, optical inter-satellite links, and autonomous control software that move AI compute beyond Earth's grid.

US-listed equity factor capturing exposure to silicon photonics and optical-interconnect enablers driving AI data-center growth.

US-listed equity factor capturing exposure to glass substrate manufacturers and the equipment ecosystem enabling next-gen advanced packaging.

US-listed equity factor capturing the value shift from legacy server power & networking architectures into AI-factory infrastructure — 800V DC delivery, wide-bandgap conversion, optical scale-out, and rack-to-cluster thermal integration.

US-listed equity factor capturing AI-chip value reratings shifting from front-end compute into the constrained advanced-packaging supply chain — CoWoS, HBM, OSAT, and the capital-equipment ecosystem enabling them.